Will Samsung and Qualcomms organic bridge technology make AI processors more powerful and cheaper to produce?

Date:
Thu, 17 Sep 2026 19:20:00 +0000

Description:
A new organic bridge under development by Samsung and Qualcomm could make AI processors more powerful.

FULL STORY ======================================================================Copy link Facebook X Whatsapp Reddit Pinterest Flipboard Threads Email Share this article 0 Join the conversation Follow us Add us as a preferred source on Google Newsletter Subscribe to our newsletter A collaboration between Samsung and Qualcomm aims to harness 'organic bridge' technology to reduce costs for AI CPUs The process is being developed for 2.1D packaging, a lower-cost integration than 2.5D , where silicon, glass, or ceramic materials are used Resins and composites are among the organic materials typically used in semiconductor integration Samsung and Qualcomm have collaborated on a new
type of CPU that takes advantage of organic materials for integration between layers, rather than silicon or its alternatives.

Described as an organic bridge, the technology is intended for AI semiconductors. The development of what has been named 2.1D packaging is
aimed at reducing costs in AI chip fabrication, where 2.5D packaging is typically used. 2.5D chips rely on silicon, glass, or ceramic for
connectivity between layers of microcircuits. With 2.1D, however, the use of organic material improves bandwidth. Latest Videos From TechRadar Watch full video here: The organic bridge The key element of the 2.1D packaging is the organic bridge. Its a technology adopted (and shrunk down) from PCB manufacture, and can reduce reduce production costs while boosting assembly. In short, it is a mass producers dream.

Rather than the silicon (or an inorganic alternative), the organic bridge is
a layer cut from resin or polymer. Its purpose is to connect multiple microcircuit dies, while providing insulation, as with silicon. However, the organic bridge has been proved to be more efficient, and can be produced more easily at scale. In addition, the organic bridge solves the supply chain issues surrounding silicon. You may like Qualcomm's new chipset architecture could lower RAM demand for AI here's how Qualcomm signs $4 billion "multi-generational" data center and AI deal with AWS Key partner to Nvidia, ASML and TSMC brings next-gen RAM and NAND replacements even closer

Development of the technology for die fabrication appears to have commenced around October 2024, when a patent for interconnected bridge technology was filed.

With the drive towards increased AI data centers in full swing, the 2.1D processor packaging could prove pivotal in delivering the predicted benefits of artificial intelligence. Are you a pro? Subscribe to our newsletter Sign
up to the TechRadar Pro newsletter to get all the top news, opinion, features and guidance your business needs to succeed! Contact me with news and offers from other Future brands Receive email from us on behalf of our trusted partners or sponsors By submitting your information you agree to the Terms & Conditions and Privacy Policy and are aged 16 or over. Multiple partners Qualcomm isnt the only partner Samsung is working with on organic bridge technology. Various other companies have also expressed an interest in developing chips with 2.1D packaging.

The significance of the drive to build 2.1D packaging for AI chips has not gone unnoticed by other companies in the tech industry. Korean magazine TheElec suggests that other Samsung customers are interested in working with the giants Samsung Electro-Mechanics subsidiary to develop 2.1D. If true,
this would suggest that 2.1D is being widely considered as one solution to
the the cost and energy demands of AI processing.

Samsung isnt the only chip maker working on 2.1D packaging. Intel Foundry Services has its own process in development, as does TSMC, which has expanded into 2.1D packaging after dominating the 2.5D market.

It seems that work between Samsung and Qualcomm has been ongoing for the past year, which indicates that it might be some time before any production-ready AI chips with 2.1D packaging are available. Follow TechRadar on Google News and add us as a preferred source to get our expert news, reviews, and opinion in your feeds.



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Link to news story: https://www.techradar.com/pro/will-samsung-and-qualcomms-organic-bridge-techno logy-make-ai-processors-more-powerful-and-cheaper-to-produce


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